BON MARK Co.,Ltd
 
Metal stencil
Electro-forming stencil Special thin foil stencil
Electro-forming stencil For SMT use
Electro-forming stencil Stencil for Chip On Board(C.O.B)
Lasar-cut stencil
Lasar-cut stencil For SMT use
Lasar-cut stencil NEO Laser-cut stencil
Chemical etching stencil
Chemical etching stencil For SMT use
Chemical etching stencil For Divice parts
Chemical etching stencil For step-down or step-up stencil
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Stencil Specification

1 Regarding Stencil Order Sheet

 
This is a just sample specification for stencil-ordering. Some specifications can be decided respectively among both side ,so there will be some difference from this standard

2 Type of Stencil

 
  Electro-Forming Stencil Laser-Cutting Stencil Chemical-Etchig Stencil
material Nickel Alloy SUS304(TA) SUS304(TA)
method Electro-Forming Laser-Cutting Chemical-Etchig
※We can also offer the following option for the better paste release performance.
BM MASK ( special coated inside aperture & bottom side ), Nimflon Plating

3 Metal Spec

 

3-1 aperture section

Electro-Forming&laser-Cutting Mask
section
Etching Mask
section
W1=size at squeeze -side
W2=size at pcb-side
W3=side ?edge size
※ordered spec can be defined either W1,W2,or W3 as customer’s request

4 Order-Receiving (provided materials)

 
Film Positive Film、Resist Film、Wiring pattern Film ,etc
Tape Medium F/D(5&3.5inch)、CD-R、MO,etc
DATA FORMAT : GERBER、IGES、SAM、DXF
Corresponding Modem、ISDN, etc
Others Real PCB 、Metal 、Drawing(with full spec)

5 Send DATA to

 
Mail address screen@bon-mark.com (JAPAN)
bmsin@bon-mark.com (Singapore)
enquiry@bon-mark.com (Singapore)
bmt@bon-mark.com (Thailand)
screen@bonmarksuzhou.com ( China )