The technology that BON MARK produces binds a person and a person, a company
and a company, society and society together by trust and with application
of the technology, we hope we will be of help for creating well developed
society
Hyper-clean
Hyper
clean is a cleaning paper roll used in automatic cleaning of solder pastes on
backside stencil. With an effect of high non-woven fabric material, its
structure is superior in strength balance of length and breadth. PP materials
(polypropylene) which is less shaggy and “tencel” material which is helpful
for cleaning of solder paste on a gold-plated PCB , both 2 types are available.
Rubber squeegee for screen printing.
Type: 1. strong against wear 2. strong against solvent
Shape 1. Plain 2. Sword-shape
(features) Its elasticity is good for flexible contact with uneven surface
its
surface has dimple hollows and being done special treatment
dimple hollows facilitate paste’s rolling performance, as the result
paste’s viscosity will become lower and contribute to better paste release
【The Patent reserved by JVC】
On PCB
side (contact side), dimple-hollows are made within pattern area
and afterward special treatment done. ( see below photo)
By the
effect of this
1、enable to avoid the spreads of flux over surrounding of the pattern
2、enable to easily detach the stencil with minimum shock from PCB without
giving the printed solder’s good shape less damage which may cause ‘short’
(‘bridge’)
3、enable to maintain proper amount of paste release as pastes remaining